China Wafer Level CSP (603005.CH)

Chinese manufacturer of wafer level chip size package and testing services.

Technology - Semiconductors & Semiconductor Equipment

IPO Performance
Latest Trade $30.06 0.00 (0.0%)
First Day Return 756.5%
Return from IPO 848.3%
 
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IPO Data
IPO File Date 01/15/2014
Offer Price $3.17
Price Range $3.17 - $3.17
Offer Shares (mm) 56.7
Deal Size ($mm) 180
 
IPO Data
IPO Date 01/20/2014
Offer Price $3.17
Price Range $3.17 - $3.17
Offer Shares (mm) 56.7
Deal Size ($mm) $180
 
Underwriters
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Business Overview
Chinese manufacturer of wafer level chip size package and testing services.
Chinese manufacturer of wafer level chip size package and testing services.
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Company Data
Headquarters , , China
Founded
Employees n/a
Website
 

Performance vs. IPO Index (IPOUSA)